Electronic device

ABSTRACT

An electronic device including a plurality of electronic components, a first substrate, a second substrate, and a third substrate is provided. The first substrate includes a first driving circuit and a first connection pad. The second substrate includes a second driving circuit and a second connection pad, and the first connection pad is coupled to the second connection pad. The first substrate, the second substrate, and the plurality of electronic components are disposed on the third substrate.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the priority benefits of U.S. provisional application Ser. No. 63/391,318, filed on Jul. 22, 2022, U.S. provisional application Ser. No. 63/391,319, filed on Jul. 22, 2022, and China application serial no. 202310463131.2, filed on Apr. 26, 2023. The entirety of each of the above-mentioned patent applications is hereby incorporated by reference herein and made a part of this specification.

BACKGROUND Technical Field

The disclosure relates to an electronic device.

Description of Related Art

When forming an electronic device, different components may have different process capability requirements. Therefore, some components of the electronic device may be independently manufactured on different substrates and then joined to make the production of components more flexible. However, if the number of connection pads of the substrate and the number of joining times are too large, the manufacturing cost of the electronic device will be increased.

SUMMARY

The disclosure provides an electronic device, which can reduce the manufacturing cost.

The electronic device provided according to some embodiments of the disclosure includes a plurality of electronic components, a first substrate, a second substrate, and a third substrate. The first substrate includes a first driving circuit and a first connection pad. The second substrate includes a second driving circuit and a second connection pad, and the first connection pad is coupled to the second connection pad. The first substrate, the second substrate, and the plurality of electronic components are disposed on the third substrate.

In order to make the above-mentioned features and advantages of the disclosure more comprehensible, the following specific embodiments are described in detail with accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is an explosion view of an electronic device of the first embodiment of the disclosure.

FIG. 1B is a schematic partial top view of the electronic device of the first embodiment of the disclosure.

FIG. 1C shows a coupling relationship between the first connection line, the first substrate, and the second substrate of the electronic device in the first embodiment of the disclosure.

FIG. 1D shows a coupling relationship between the second connection line, the first substrate, and the second substrate of the electronic device in the first embodiment of the disclosure.

FIG. 1E shows a coupling relationship between the third connection line, the first substrate, and the second substrate of the electronic device in the first embodiment of the disclosure.

FIG. 1F shows a coupling relationship between the fourth connection line, the first substrate, and the second substrate of the electronic device in the first embodiment of the disclosure.

FIG. 2 is a schematic partial top view of an electronic device of the second embodiment of the disclosure.

DESCRIPTION OF THE EMBODIMENTS

Reference will now be made in detail to the exemplary embodiments of the disclosure, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numerals are used in the drawings and descriptions to refer to the same or like parts.

This disclosure may be understood by referring to the following detailed description and combined with the accompanying drawings. It should be noted that, in order to make the readers easy to understand and the brevity of the drawings, many drawings in this disclosure only draw a part of the electronic device, and certain components in the drawings are not drawn to actual scale. In addition, the number and size of each component in the drawings are only for illustration, and are not intended to limit the scope of the disclosure.

Certain terms are used throughout this disclosure and in the appended claims to refer to particular components. Persons skilled in the art should understand that electronic device manufacturers may refer to the same component by different names. This document does not intend to distinguish between components that have the same function but have different names. In the following specification and patent application scope, words such as “comprising”, “containing”, and “having” are open-ended words, so they should be interpreted as meaning “including but not limited to . . . ”. Therefore, when the terms “comprising”, “containing” and/or “having” are used in the description of the disclosure, the existence of corresponding features, regions, steps, operations, and/or components is specified, but the existence of one or multiple corresponding features, regions, steps, operations, and/or components are not excluded.

Direction terms mentioned in this article, such as “upper”, “lower”, “front”, “rear”, “left”, “right”, are only referring to the direction of the accompanying drawings. Accordingly, the direction term is used to illustrate, not to limit, the disclosure. In the drawings, each drawing illustrates the general characteristics of methods, structures, and/or materials used in particular embodiments. However, these drawings should not be interpreted as defining or limiting the scope or nature encompassed by these embodiments. For example, the relative sizes, thicknesses, and positions of layers, regions, and/or structures may be reduced or exaggerated for clarity.

When a corresponding component (e.g., a film or region) is referred to as being “on” another component, it may be directly on the other component or there may be other components interposed therebetween. On the other hand, when a component is referred to as being “directly on” another component, then there is no component in between. In addition, when a component is referred to as “on another component”, the two have a vertical relationship in the direction of the top view, and the component may be above or below the other component, and this vertical relationship depends on the orientation of the device.

The terms “equal to” or “the same”, “substantially”, or “approximately” are generally interpreted as being within 20% of a given value or range, or as being within 10%, 5% of a given value or range %, 3%, 2%, 1% or within 0.5%.

The ordinal numbers used in the specification and patent claims, such as “first”, “second”, are used to modify components, which do not imply and represent that the (or these) components have any previous ordinal numbers, nor do they represent the order of an component with another component, or the order of the manufacturing method, the use of these ordinal numbers is only used to clearly distinguish a component with a certain designation from another component with the same designation. The same wording may not be used in the scope of the appended claims and in the specification. Accordingly, the first component in the specification may be the second component in the scope of the appended claims.

It should be noted that in the following embodiments, without departing from the spirit of the disclosure, features in several different embodiments may be replaced, reorganized, and mixed to complete other embodiments. As long as the features of the various embodiments do not violate the spirit of the disclosure or conflict with each other, they may be mixed and matched arbitrarily.

The electrical connection or coupling described in this disclosure may refer to direct connection or indirect connection. In the case of direct connection, terminals of the components on two circuit are directly connected or connected with each other by a conductive line, in the case of indirect connection, there are switches, diodes, capacitors, inductors, other suitable components, or a combination of the above components between the terminals of the components on the two circuits, but is not limited thereto.

In the disclosure, the thickness, length, width, and area may be measured by using an optical microscope, and the thickness may be measured by a cross-sectional image in an electron microscope, but is not limited thereto. In addition, any two numerical values or directions used for comparison may have certain errors. If the first value is equal to the second value, there may be approximately 10% error between the first value and the second value; if the first direction is perpendicular to the second direction, the angle between the first direction and the second direction may be from 80 degrees to 100 degrees; if the first direction is parallel to the second direction, the angle between the first direction and the second direction may be from 0° to 10°.

An electronic device disclosed in this disclosure may include display, lighting, antenna, sensing, touch, splicing, other suitable functions, or a combination of the above functions, but is not limited thereto. The electronic device includes, but is not limited to, a rollable or flexible electronic device. The display device may, for example, include liquid crystal, light emitting diode (LED), quantum dot (QD), fluorescence, phosphor, other suitable materials or a combination of the above-mentioned. The LED may, for example, include organic light emitting diodes (OLEDs), mini-LEDs, micro-LEDs, QLEDs, or QDLEDs, but is not limited thereto. The antenna device may be, for example, a liquid crystal antenna or a varactor diode antenna, but is not limited thereto. The electronic component may include a transistor, a circuit board, a chip, a die, an integrated circuit (IC), or a combination of the above components or other suitable electronic components, but is not limited thereto.

FIG. 1A is an explosion view of an electronic device of the first embodiment of the disclosure, and FIG. 1B is a schematic partial top view of the electronic device of the first embodiment of the disclosure.

Please refer to FIG. 1A and FIG. 1B at the same time. An electronic device 10 a of this embodiment includes a plurality of electronic components EC, a first substrate SB1, a second substrate SB2, and a third substrate SB3, but the disclosure is not limited thereto.

The plurality of electronic components EC are, for example, disposed on the third substrate SB3. In some embodiments, the plurality of electronic components EC may include photoelectric components, pyroelectric components, piezoelectric components, sensing components, or antenna components, but the disclosure is not limited thereto. For example, when the electronic device 10 a of this embodiment is a photosensitive device, the electronic component EC may include a plurality of photoelectric components, in which the semiconductor in the photoelectric component may receive a light and generate carriers (such as electrons and/or holes), and then the carriers may be transmitted to an external circuit through the corresponding signal lines (such as reading lines) to realize a light sensing effect. In addition, when the electronic device 10 a of this embodiment is a light-emitting device (such as an organic light-emitting diode display device, a micro LED display device, or a mini LED display device), the electronic component EC may include a plurality of light emitting components, which may emit various suitable colors of light or UV light, for example, including organic light emitting diodes (OLED), inorganic light emitting diodes (inorganic LED), such as mini LEDs or micro LEDs, quantum dot (QD), quantum dot light emitting diode (QLED, QDLED), fluorescence, phosphor, others suitable materials or combinations of the above materials, but the disclosure is not limited thereto. In addition, when the electronic device 10 a of this embodiment is an antenna device, the electronic component EC may, for example, include a varactor diode, which may change the amount of the capacitance value of the varactor diode by changing voltages of two terminals of the varactor diode. Therefore, by adjusting the capacitance value of the varactor diode, the electronic device 10 a in this embodiment may adjust the operating frequency band, but the disclosure is not limited thereto.

The first substrate SB1 is, for example, disposed on the third substrate SB3. In some embodiments, the first substrate SB1 and the third substrate SB3 are joined to each other on a third direction d3 (a top view direction of the third substrate SB3), but the disclosure is not limited thereto. In this embodiment, the first substrate SB1 includes a first driving circuit C1. The first driving circuit C1 may, for example, include a gate driving circuit or a pixel driving circuit, but the disclosure is not limited thereto. In this embodiment, the first driving circuit C1 may be a gate driving circuit (for example, a gate on panel; GOP) of the electronic device 10 a, but the disclosure is not limited thereto. In some embodiments, the first driving circuit C1 may include a plurality of shift registers (not shown), in which one of the plurality of shift registers may include a pull-up unit (not shown) and/or a pull-down unit (not shown), but the disclosure is not limited thereto. In some embodiments, the first substrate SB1 may include a plurality of connection pads, and at least one of the plurality of connection pads is coupled to the first driving circuit C1. For example, the first substrate SB1 includes a first connection pad PAD1, and the first driving circuit C1 may be coupled to the first connection pad PAD1. In some embodiments, the first substrate SB1 may further include a first signal transmission line ST1, in which the first driving circuit C1 may be coupled to the first connection pad PAD1 through the first signal transmission line ST1, but the disclosure is not limited thereto. In addition, the first connection pad PAD1 may be coupled to an external circuit such as a circuit board (not shown) or a chip (not shown) disposed on the third substrate SB3, and the first driving circuit C1 may be controlled through this external circuit, but the disclosure is not limited thereto. The material of the first connection pad PAD1 may include metal, alloy, metal oxide, or a combination thereof, and the first connection pad PAD1 may be, for example, a single-layer structure or a multi-layer structure, and the disclosure is not limited thereto. In some embodiments, the first substrate SB1 further includes a first base BA1. The material of the first base BA1 may be, for example, glass, plastic, or a combination thereof. For example, the material of the first base BA1 may include quartz, sapphire, Si, Ge, SiC, GaN, SiGe, polymethyl methacrylate (PMMA), polycarbonate (PC), polyimide (PI), polyethylene terephthalate (PET) or other suitable materials, or combinations of the above materials, but the disclosure is not limited thereto. In this embodiment, the material of the first base BA1 is glass, but the disclosure is not limited thereto.

The second substrate SB2 may be disposed on the third substrate SB3. In some embodiments, the second substrate SB2 and the third substrate SB3 are joined to each other on the third direction d3, but the disclosure is not limited thereto. In this embodiment, the second substrate SB2 includes a second driving circuit C2. The second driving circuit C2 may, for example, be the same as or different from the first driving circuit C1, but the disclosure is not limited thereto. In some embodiments, the designs of the first substrate SB1 and the second substrate SB2 may be the same or different, but the disclosure is not limited thereto. In some embodiments, the second substrate SB2 may also include a plurality of connection pads, and at least one of the plurality of connection pads is coupled to the second driving circuit C2. For example, the second substrate SB2 includes a second connection pad PAD2, and the second driving circuit C2 may be coupled to the second connection pad PAD2. In some embodiments, the second substrate SB2 may further include a second signal transmission line ST2, in which the second driving circuit C2 may be coupled to the second connection pad PAD2 through the second signal transmission line ST2. In addition, the second connection pad PAD2 may also be coupled to an external circuit such as the circuit board (not shown) or the chip (not shown) disposed on the third substrate SB3, and the second driving circuit C2 may be controlled through this external circuit, but the disclosure is not limited thereto. The material of the second connection pad PAD2 may include metal, alloy, metal oxide, or a combination thereof, and the second connection pad PAD2 may be, for example, a single-layer structure or a multi-layer structure, and the disclosure is not limited thereto. In some embodiments, the second substrate SB2 further includes a second base BA2. The material of the second base BA2 may be, for example, glass, plastic, or a combination thereof. For example, the material of the second base BA2 may include quartz, sapphire, Si, Ge, SiC, GaN, SiGe, polymethyl methacrylate (PMMA), polycarbonate (PC), polyimide (PI), polyethylene terephthalate (PET) or other suitable materials, or combinations of the above materials, but the disclosure is not limited thereto. In this embodiment, the material of the second base BA2 is the same as the material of the first base BA1, that is, the material of the second base BA2 is glass, but the disclosure is not limited thereto.

The third substrate SB3 includes, for example, a first connection line CL1, a second connection line CL2, a third connection line CL3, and a fourth connection line CL4, in which a coupling relationship between the first connection line CL1, the second connection line CL2, the third connection line CL3, and the fourth connection line CL4 and other components and their usage will be described in detail in the following embodiments.

In some embodiments, the third substrate SB3 further includes a third base BA3. The material of the third base BA3 may be, for example, glass, plastic, or a combination thereof. For example, the material of the third base BA3 may include quartz, sapphire, Si, Ge, SiC, GaN, SiGe, polymethyl methacrylate (PMMA), polycarbonate (PC), polyimide (PI), polyethylene terephthalate (PET) or other suitable materials, or combinations of the above materials, but the disclosure is not limited thereto. In some embodiments, the third substrate SB3 is larger than the first substrate SB1 and the second substrate SB2. In addition, although not shown in the drawings, the third substrate SB3 may also include suitable components such as insulating layers, capacitors, passive components, other driving circuits and/or a plurality of electrodes, but the disclosure is not limited thereto. FIG. 1C shows a coupling relationship between the first connection line, the first substrate, and the second substrate of the electronic device in the first embodiment of the disclosure.

In this embodiment, a first connection pad PAD12 (PAD1) is coupled to a second connection pad PAD21 (PAD2). In detail, as shown in FIG. 1C, the first connection pad PAD12 (PAD1) and the second connection pad PAD21 (PAD2) may be coupled through the first connection line CL1 disposed on the third substrate SB3, in which the first connection line CL1 extends along a first direction d1, but the disclosure is not limited thereto. The first direction d1 may be, for example, orthogonal to the third direction d3, but the disclosure is not limited thereto. Based on this, the first driving circuit C1 and the second driving circuit C2 may be coupled in series, for example, through the first connection pad PAD12 (PAD1), the second connection pad PAD21 (PAD2), and the first connection line CL1, so that the first connection line CL1 may, for example, transmit a driving signal (such as a push signal) generated in the first driving circuit C1 to the second driving circuit C2, but the disclosure is not limited thereto.

In some embodiments, the first substrate SB1 may further include a third connection pad PAD3 and a third signal transmission line ST3, and the second substrate SB2 may further include a fourth connection pad PAD4 and a fourth signal transmission line ST4.

FIG. 1D shows a coupling relationship between the second connection line, the first substrate, and the second substrate of the electronic device in the first embodiment of the disclosure.

The first driving circuit C1 may, for example, be coupled to the third connection pad PAD3, and the second driving circuit C2 may, for example, be coupled to the fourth connection pad PAD4. In some embodiments, the first driving circuit C1 may be coupled to the third connection pad PAD3 through the third signal transmission line ST3, and the second driving circuit C2 may be coupled to the fourth connection pad PAD4 through the fourth signal transmission line ST4, but the disclosure is not limited thereto. In this embodiment, the third connection pad PAD3 is coupled to the fourth connection pad PAD4, and the third connection pad PAD3 and the fourth connection pad PAD4 may be coupled to an external circuit such as the circuit board (not shown) or the chip (not shown) disposed on the third substrate SB3 to be used to control the first driving circuit C1 and the second driving circuit C2 respectively, but the disclosure is not limited thereto.

In detail, as shown in FIG. 1D, the third connection pad PAD3 and the fourth connection pad PAD4 may be coupled through the second connection line CL2 disposed on the third substrate SB3 and coupled to an external circuit, in which the second connection line CL2 may be, for example, used to transmit a driving signal (such as a start signal) from the external circuit to the first driving circuit C1 and the second driving circuit C2 respectively, but the disclosure is not limited thereto. Based on this, the first driving circuit C1 and the second driving circuit C2 may be driven, for example, through the start signal transmitted by the second connection line CL2, but the disclosure is not limited thereto. In some embodiments, the driving signal from the external circuit may be a data signal or a power signal, but the disclosure is not limited thereto. In some embodiments, the driving signals transmitted to the first driving circuit C1 and the second driving circuit C2 may be the same or different, but the disclosure is not limited thereto.

FIG. 1E shows a coupling relationship between the third connection line, the first substrate, and the second substrate of the electronic device in the first embodiment of the disclosure.

In this embodiment, the first substrate SB1 also includes a first input connection pad SB1_PADin1 and a first output connection pad SB1_PADout1, in which a terminal C1_T1 of the first driving circuit C1 is coupled to the first input connection pad SB1_PADin1, and another terminal C1_T2 of the first driving circuit C1 is coupled to the first output connection pad SB1_PADout1. In some embodiments, the first substrate SB1 may also include a first input signal transmission line SB1_STin1 and a first output signal transmission line SB1_STout1, in which the terminal C1_T1 of the first driving circuit C1 may be coupled to the first input connection pad SB1_PADin1 through the first input signal transmission line SB1_STin1, and the other terminal C1_T2 of the first driving circuit C1 may be coupled to the first output connection pad SB1_PADout1 through the first output signal transmission line SB1_STout1. In some embodiments, the first input connection pad SB1_PADin1 may be coupled to an external circuit such as the circuit board (not shown) or the chip (not shown) disposed on the third substrate SB3, and may be used to control the first driving circuit C1, and the first output connection pad SB1_PADout1 may be coupled to an active component (not shown), and may be used to control a corresponding electronic component EC, but the disclosure is not limited thereto.

In detail, as shown in FIG. 1E, the terminal C1_T1 of the first driving circuit C1 may be coupled to an external circuit through the third connection line CL3 disposed on the third substrate SB3, in which the third connection line CL3 may be used, for example, to transmit a driving signal (such as a clock signal) from an external circuit to the first driving circuit C1, but the disclosure is not limited thereto. The third connection line CL3 may, for example, extend along a second direction d2, in which the second direction d2 may be orthogonal to the first direction d1 and the third direction d3, but the disclosure is not limited thereto. In addition, as shown in FIG. 1A and FIG. 1E, the other terminal C1_T2 of the first driving circuit C1 may be coupled to the corresponding electronic component EC through a gate line GL1 disposed on the third substrate SB3. Based on this, for example, the clock signal may be transmitted to the first input connection pad SB1_PADin1 through the third connection line CL3, so that the first driving circuit C1 may output a corresponding gate signal after receiving the clock signal, and then the first driving circuit C1 may transmit the corresponding gate signal to the corresponding active component through the corresponding gate line GL1 in order to, for example, turn on the active component to control the corresponding electronic component EC.

It is worth noting that a terminal C2_T1 of the second driving circuit C2 in the second substrate SB2 may also be coupled to an external circuit through the third connection line CL3 disposed on the third substrate SB3, and another terminal C2_T2 of the second driving circuit C2 may also be coupled to the corresponding electronic component EC through a gate line GL2 disposed on the third substrate SB3.

In detail, the second substrate SB2 also includes a first input connection pad SB2_PADin1 and a first output connection pad SB2_PADout1, the terminal C2_T1 of the second driving circuit C2 is coupled to the first input connection pad SB2_PADin1, and the other terminal C2_T2 of the second driving circuit C2 is coupled to the first output connection pad SB2_PADout1. In some embodiments, the second substrate SB2 may further include a first input signal transmission line SB2_STin1 and a first output signal transmission line SB2_STout1, in which the terminal C2_T1 of the second driving circuit C2 may be coupled to the first input connection pad SB2_PADin1 through the first input signal transmission line SB2_STin1, and the other terminal C2_T2 of the second driving circuit C2 may be coupled to the first output connection pad SB2_PADout1 through the first output signal transmission line SB2_STout1.

In some embodiments, the first input connection pad SB2_PADin1 of the second substrate SB2 may be coupled to an external circuit such as the circuit board (not shown) or the chip (not shown) disposed on the third substrate SB3 in order to, for example, be used to control the second driving circuit C2, and the first output connection pad SB2_PADout1 of the second substrate SB2 may be coupled to an active component (not shown), and may be used to control the corresponding electronic component EC, but the disclosure is not limited thereto.

In this embodiment, the first substrate SB1 also includes a third driving circuit C3, a second input connection pad SB1_PADin2, and a second output connection pad SB1_PADout2, in which a terminal C3_T1 of the third driving circuit C3 is coupled to the second input connection pad SB1_PADin2, and another terminal C3_T2 of the third driving circuit C3 is coupled to the second output connection pad SB1_PADout2. In some embodiments, the first substrate SB1 may further include a second input signal transmission line SB1_STin2 and a second output signal transmission line SB1_STout2, in which the terminal C3_T1 of the third driving circuit C3 may be coupled to the second input connection pad SB1_PADin2 through the second input signal transmission line SB1_STin2, and the other terminal C3_T2 of the third driving circuit C3 may be coupled to the second output connection pad SB1_PADout2 through the second output signal transmission line SB1_STout2. In some embodiments, the second input connection pad SB1_PADin2 may be coupled to an external circuit such as the circuit board (not shown) or the chip (not shown) disposed on the third substrate SB3, and may be used to control the third driving circuit C3, and the second output connection pad SB1_PADout2 may be coupled to an active component (not shown), and may be used to control a corresponding electronic component EC, but the disclosure is not limited thereto. The purpose of the second input connection pad SB1_PADin2 and the second output connection pad SB1_PADout2 may be, for example, the same as or different from the purpose of the first input connection pad SB1_PADin1 and the first output connection pad SB1_PADout1 in the foregoing embodiments, but the disclosure is not limited thereto. In this embodiment, the first input connection pad SB1_PADin1 and the second input connection pad SB1_PADin2 independently receive driving signals (such as clock signals) from the external circuit.

In addition, in this embodiment, the second substrate SB2 also includes a fourth driving circuit C4, a second input connection pad SB2_PADin2, and a second output connection pad SB2_PADout2, in which a terminal C4_T1 of the fourth driving circuit C4 is coupled to the second input connection pad SB2_PADin2, and another terminal C4_T2 of the fourth driving circuit C4 is coupled to the second output connection pad SB2_PADout2. In some embodiments, the second substrate SB2 may further include a second input signal transmission line SB2_STin2 and a second output signal transmission line SB2_STout2, in which the terminal C4_T1 of the fourth driving circuit C4 may be coupled to the second input connection pad SB2_PADin2 through the second input signal transmission line SB2_STin2, and the other terminal C4_T2 of the fourth driving circuit C4 may be coupled to the second output connection pad SB2_PADout2 through the second output signal transmission line SB2_STout2. In some embodiments, the second input connection pad SB2_PADin2 may be coupled to an external circuit such as the circuit board (not shown) or the chip (not shown) disposed on the third substrate SB3 in order to, for example, be used to control the third driving circuit C3, and the first output connection pad SB2_PADout1 may be coupled to an active component (not shown) in order to, for example, be used to control a corresponding electronic component EC. The purpose of the second input connection pad SB2_PADin2 and the second output connection pad SB2_PADout2 may be the same as or different from the purpose of the first input connection pad SB2_PADin1 and the first output connection pad SB2_PADout1 in the foregoing embodiment, but the disclosure is not limited thereto. FIG. 1F shows a coupling relationship between the fourth connection line, the first substrate, and the second substrate of the electronic device in the first embodiment of the disclosure.

In this embodiment, the first substrate SB1 further includes a fifth connection pad PADS, in which the first driving circuit C1 and the third driving circuit C3 are coupled to the fifth connection pad PADS, for example. In some embodiments, the first substrate SB1 may further include a fifth signal transmission line ST5, in which the first driving circuit C1 and the third driving circuit C3 may be coupled to the fifth connection pad PADS through the fifth signal transmission line ST5. In some embodiments, the fifth connection pad PADS may be coupled to an external circuit such as the circuit board (not shown) or the chip (not shown) disposed on the third substrate SB3, for example, to control the first driving circuit C1 and the third driving circuit C3, but the disclosure is not limited thereto.

In detail, as shown in FIG. 1F, the fifth connection pad PADS may be coupled to the external circuit through the fourth connection line CL4 disposed on the third substrate SB3, in which the fourth connection line CL4 may be used, for example, to transmit driving signals (such as pull-up signals and/or pull-down signals) from the external circuit to the first driving circuit C1 and the third driving circuit C3, but the disclosure is not limited thereto. Based on this, the voltages of the respective operation nodes of the first driving circuit C1 and the third driving circuit C3 may be pulled up to a high level and/or pulled down to a low level, for example, through the pull-up signal and/or the pull-down signal transmitted through the fourth connection line CL4, but the disclosure is not limited thereto.

In addition, in this embodiment, the second substrate SB2 further includes a sixth connection pad PAD6, in which the second driving circuit C2 and the fourth driving circuit C4 are coupled to, for example, the sixth connection pad PAD6. In some embodiments, the second substrate SB2 may further include a sixth signal transmission line ST6, in which the second driving circuit C2 and the fourth driving circuit C4 may be coupled to the sixth connection pad PAD6 through the sixth signal transmission line ST6. In some embodiments, the sixth connection pad PAD6 may be coupled to an external circuit such as the circuit board (not shown) or the chip (not shown) disposed on the third substrate SB3, for example, to control the second driving circuit C2 and the fourth driving circuit C4, but the disclosure is not limited thereto. The purpose of the sixth connection pad PAD6 may be the same as or different from the purpose of the fifth connection pad PADS in the foregoing embodiment, but the disclosure is not limited thereto. Through the aforementioned configuration of disposing the first substrate SB1 and the second substrate SB2 on the third substrate SB3, in some embodiments, the first connection line CL1, the second connection line CL2, the third connection line CL3, and the fourth connection line CL4 in the third substrate SB3 may be disposed on the same layer or on different layers. For example, the first connection line CL1, the second connection line CL2, the third connection line CL3, and the fourth connection line CL4 may belong to the same layer as the gate lines GL1, GL2 or a gate (not shown) of the active component, which can reduce the manufacturing process steps/or the number of masks used in the formation of the first connection line CL1, the second connection line CL2, the third connection line CL3, and the fourth connection line CL4, or one or two of the first connection line CL1, the second connection line CL2, the third connection line CL3, and the fourth connection line CL4 may be on the same layer as the gate lines GL1, GL2, and the rest are on different layers from the gate lines GL1, GL2, which can reduce the manufacturing process steps/or the number of masks used in the formation of the first connection line CL1, the second connection line CL2, the third connection line CL3, and the fourth connection line CL4, further, one or two of the first connection line CL1, the second connection line CL2, the third connection line CL3, and the fourth connection line CL4 may be on the same layer with a data line not shown in the drawing, and the rest are on different layers from the data line not shown in the drawing, which can reduce the manufacturing process steps/or the number of masks used in the formation of the first connection line CL1, the second connection line CL2, the third connection line CL3, and the fourth connection line CL4, and may reduce the design difficulty of the third substrate SB3 and improve the yield rate of the electronic device 10 a. In some embodiments, the first substrate SB1 and the second substrate SB2 may be disposed in an active area or in a peripheral area. In some embodiments, any one of the first substrate SB1 and the second substrate SB2 may be disposed in the active area and the other may be disposed in the peripheral area. In some embodiments, the first substrate SB1 and the second substrate SB2 may both be disposed in the active area. In some embodiments, the first substrate SB1 and the second substrate SB2 may both be disposed in the peripheral area. Depending on the application of the electronic device, the active area may be, for example, a display area, a light emitting area, an antenna active area, but the disclosure is not limited thereto.

The quantitative relationship between the driving circuit and the connection pads in the first substrate SB1 and the second substrate SB2 will be introduced below, but the disclosure is not limited thereto.

In this embodiment, the first driving circuit C1 and the third driving circuit C3 in the first substrate SB1 are arranged in a unidirectional arrangement. In detail, the first driving circuit C1 and the third driving circuit C3 may be arranged along the first direction d1, for example, but the disclosure is not limited thereto. In this embodiment, one first substrate SB1 may include n driving circuits (including the first driving circuit C1 and the third driving circuit C3), in which n is a positive integer greater than or equal to 2. In this embodiment, n is 2, that is, one first substrate SB1 includes two driving circuits (one first driving circuit C1 and one third driving circuit C3), but the disclosure is not limited thereto.

In addition, in this embodiment, the second driving circuit C2 and the fourth driving circuit C4 in the second substrate SB2 are arranged in a unidirectional arrangement. In detail, the second driving circuit C2 and the fourth driving circuit C4 may be arranged along the first direction d1, for example, but the disclosure is not limited thereto. In this embodiment, one second substrate SB2 may include n driving circuits (including the second driving circuit C2 and the fourth driving circuit C4), in which n is a positive integer greater than or equal to 2. In this embodiment, n is 2, that is, one second substrate SB2 includes two driving circuits (one second driving circuit C2 and one fourth driving circuit C4), but the disclosure is not limited thereto.

In this embodiment, the first connection pad PAD1 is disposed on corresponding two sides of the first substrate SB1 (a first side SB1_S1 and a second side SB1_S2), and the second connection pad PAD2 is disposed on corresponding two sides of the second substrate SB2 (a first side SB2_S1 and a second side SB2_S2; in addition, the remaining corresponding two sides of the second substrate SB2 are a third side SB2_S3 and a fourth side SB2_S4). In detail, the first connection pad PAD1 may include, for example, a first connection pad PAD11 disposed on the first side SB1_S1 of the first substrate SB1 and the first connection pad PAD12 of the second side SB1_S2, and the second connection pad PAD2 may, for example, include the second connection pad PAD21 disposed on the first side SB2_S1 of the second substrate SB2 and a second connection pad PAD22 of the second side SB2_S2, in which the first connection pad PAD11, the first connection pad PAD12, the second connection pad PAD21, and the second connection pad PAD22 may be, for example, disposed along the first direction d1, the first connection pad PAD11 is coupled to the first connection pad PAD12 through the first signal transmission line ST1, and the second connection pad PAD21 is coupled to the second connection pad PAD22 through the second signal transmission line ST2, and the first connection pad PAD12 is coupled to the second connection pad PAD21 through the first connection line CL1. That is, the driving signal may be transmitted from the first substrate SB1 to the second substrate SB2 through the first connection pad PAD12 of the first substrate SB1, the second connection pad PAD21 of the second substrate SB2, and the first connection line CL1. Based on this, one first substrate SB1 may include two first connection pads PAD1, and one second substrate SB2 may include two second connection pads PAD2.

In this embodiment, the third connection pad PAD3 is disposed on the first side SB1_S1 of the first substrate SB1, and is arranged along the first direction d1 with the first driving circuit C1 and the third driving circuit C3, and the fourth connection pad PAD4 is disposed on the first side SB2_S1 of the second substrate SB2, and arranged along the first direction d1 with the second driving circuit C2 and the fourth driving circuit C4. Based on this, one first substrate SB1 may include one third connection pad PAD3, and one second substrate SB2 may include one fourth connection pad PAD4.

In this embodiment, the first input connection pad SB1_PADin1 and the first output connection pad SB1_PADout1 of the first substrate SB1 are respectively disposed on the corresponding two sides of the first substrate SB1 (a third side SB1_S3 and a fourth side SB1_S4), and the second input connection pad SB1_PADin2 and the second output connection pad SB1_PADout2 of the first substrate SB1 are respectively disposed on corresponding two sides of the first substrate SB1 (the third side SB1_S3 and the fourth side SB1_S4). The first input connection pad SB1_PADin1 and, for example, the second input connection pad SB1_PADin2, are arranged alternately on the first direction d1, and are respectively arranged corresponding to the first driving circuit C1 and the third driving circuit C3. In detail, the first substrate SB1 may also include n input connection pads (first input connection pads SB1_PADin1 and second input connection pads SB1_PADin2). In addition, the first output connection pads SB1_PADout1 and the second output connection pads SB1_PADout2 are alternately arranged on the first direction d1, and are also respectively arranged corresponding to the first driving circuit C1 and the third driving circuit C3. In detail, the first substrate SB1 may also include n output connection pads (the first output connection pads SB1_PADout1 and the second output connection pads SB1_PADout2).

In addition, the disposed relationship and quantity of the first input connection pad SB2_PADin1, the first output connection pad SB2_PADout1, the second input connection pad SB2_PADin2, and the second output connection pad SB2_PADout2 of the second substrate SB2 may respectively refer to the description regarding the first input connection pad SB1_PADin1 of the first substrate SB1, the first output connection pad SB1_PADout1, the second input connection pad SB1_PADin2, and the second output connection pad SB1_PADout2 of the foregoing embodiments, and will not be repeated here.

In this embodiment, the fifth connection pad PADS is disposed on the second side SB1_S2 of the first substrate SB1, and is coupled in parallel with the first driving circuit C1 and the third driving circuit C3, the sixth connection pad PAD6 is disposed on the second side SB2_S2 of the second substrate SB2, and is coupled in parallel with the second driving circuit C2 and the fourth driving circuit C4. Based on this, one first substrate SB1 may include one fifth connection pad PADS, and one second substrate SB2 may include one sixth connection pad PAD6.

In general, the quantitative relationship between the driving circuit and the connection pads in the first substrate SB1 of this embodiment may be summarized in the following Table 1, in which the driving circuit in Table 1 includes the first driving circuit C1 and the third driving circuit C3, the input connection pads include the first input connection pad SB1_PADin1 and the second input connection pad SB1_PADin2, and the output connection pads include the first output connection pad SB1_PADout1 and the second output connection pad SB1_PADout2.

TABLE 1 The total The number of number The The The connection of number of number of The The number of pads/ driving the first the third number of number of the fifth The total the circuits connection connection input output connection number of number of (n, pads pads connection connection pads connection driving n = 2) PAD1 PAD3 pads (n) pads (n) PAD5 pads circuits 2 2 1 2 2 1 8 4.0

In addition, the quantitative relationship between the driving circuit and the connection pads in the second substrate SB2 is the same or similar to the quantitative relationship between the driving circuit and the connection pads in the first substrate SB1, and will not be repeated here.

FIG. 2 is a schematic partial top view of an electronic device of the second embodiment of the disclosure. It should be noted that, the embodiment in FIG. 2 may continue to use the reference numerals and part of content of the embodiment in FIG. 1B, in which the same or similar numerals are used to denote the same or similar components, and the description of the same technical content is omitted.

Please refer to FIG. 2 , the main difference between an electronic device 10 b of this embodiment and the electronic device 10 a is that, the first substrate SB1 of the electronic device 10 b further includes a fifth driving circuit C5.

The fifth driving circuit C5 is arranged on the first direction d1 together with, for example, the first driving circuit C1 and the third driving circuit C3. In detail, in this embodiment, the first driving circuit C1, the third driving circuit C3, and the fifth driving circuit C5 are arranged in this order on the first direction d1, but the disclosure is not limited thereto. As mentioned above, although the number of driving circuits and connection pads in the first substrate SB1 and the second substrate SB2 is the same in FIG. 1B to FIG. 1F, in some embodiments, the number of the driving circuit and the connection pads in the first substrate SB1 and the second substrate SB2 may be chosen by the user to be not the same, for example, either one of the first substrate SB1 and the second substrate SB2 may be chosen to be in the manner as shown in FIG. 1B, and the other one may be chosen to be in the manner as shown in FIG. 2 , but the disclosure is not limited thereto.

In this embodiment, the first substrate SB1 further includes a third input connection pad SB1_PADin3 and a third output connection pad SB1_PADout3. The third input connection pad SB1_PADin3 and the third output connection pad SB1_PADout3 are respectively disposed on corresponding two sides of the first substrate SB1 (the third side SB1_S3 and the fourth side SB1_S4). The third input connection pad SB1_PADin3 and the third output connection pad SB1_PADout3 are disposed correspondingly, for example, through a third input signal transmission line SB1_STin3 and a third output signal transmission line SB1_STout3 respectively, with respect to the fifth driving circuit C5, in which a terminal C5_T1 of the fifth driving circuit C5 is coupled to the third input connection pad SB1_PADin3, and another terminal C5_T2 of the fifth driving circuit C5 is coupled to the third output connection pad SB1_PADout3. Based on this, the first substrate SB1 includes 3 input connection pads and 3 output connection pads (n=3).

In general, the quantitative relationship between the driving circuit and the connection pads in the first substrate SB1 of this embodiment may be summarized in the following Table 2, the driving circuit in Table 2 includes the first driving circuit C1, the third driving circuit C3, and the fifth driving circuit C5, the input connection pads include the first input connection pad SB1_PADin1, the second input connection pad SB1_PADin2, and the third input connection pad SB1_PADin3, and the output connection pads include the first output connection pad SB1_PADout1, the second output connection pad SB1_PADout2, and the third output connection pad SB1_PADout3.

TABLE 2 The total The number of number The The The connection of number of number of The The number of pads/ driving the first the third number of number of the fifth The total the circuits connection connection input output connection number of number of (n, pads pads connection connection pads connection driving n = 3) PAD1 PAD3 pads (n) pads (n) PAD5 pads circuits 3 2 1 3 3 1 10 3.3

In this embodiment, one first substrate SB1 of the electronic device 10 b includes a large number of driving circuits. Therefore, the ratio of the total number of connection pads of the electronic device 10 b to the number of driving circuits may be low, which can further reduce the number of connection pads disposed to reduce the manufacturing cost.

In addition, although not shown in the drawings, when the number of driving circuits in the first substrate SB1 of this embodiment is 4, 5, and 6, respectively, the quantitative relationship of the connection pads therebetween is summarized as the following Table 3, Table 4, and Table 5. It is worth noting that although the driving circuit and connection pads in the first substrate SB1 are taken as an example, the quantitative relationship between the driving circuit and the connection pads in the second substrate SB2 may also refer to Table 3, Table 4, and Table 5, and will not be repeated here.

TABLE 3 The total The number of number The The The connection of number of number of The The number of pads/ driving the first the third number of number of the fifth The total the circuits connection connection input output connection number of number of (n, pads pads connection connection pads connection driving n = 4) PAD1 PAD3 pads (n) pads (n) PAD5 pads circuits 4 2 1 4 4 1 12 3.0

TABLE 4 The total The number of number The The The connection of number of number of The The number of pads/ driving the first the third number of number of the fifth The total the circuits connection connection input output connection number of number of (n, pads pads connection connection pads connection driving n = 5) PAD1 PAD3 pads (n) pads (n) PAD5 pads circuits 5 2 1 5 5 1 14 2.8

TABLE 5 The total The number of number The The The connection of number of number of The The number of pads/ driving the first the third number of number of the fifth The total the circuits connection connection input output connection number of number of (n, pads pads connection connection pads connection driving n = 6) PAD1 PAD3 pads (n) pads (n) PAD5 pads circuits 6 2 1 6 6 1 16 2.7

In summary, in the electronic device provided by some embodiments of the disclosure, a plurality of driving circuits and connection pads are formed on the first substrate (or the second substrate), which can reduce the number of connection pads and the number of bonding times between the first substrate (or the second substrate) and the third substrate to reduce the manufacturing cost of forming this electronic device. Furthermore, the electronic device in some embodiments of the disclosure may choose a suitable driving circuit, and the electronic device may be applied in different technical fields, so that the electronic device provided by some embodiments of the disclosure may be applied to various fields demand. 

What is claimed is:
 1. An electronic device, comprising: a plurality of electronic components; a first substrate comprising a first driving circuit and a first connection pad; a second substrate comprising a second driving circuit and a second connection pad, and the first connection pad is coupled to the second connection pad; and a third substrate, wherein the first substrate, the second substrate, and the plurality of electronic components are disposed on the third substrate.
 2. The electronic device according to claim 1, wherein the first driving circuit is coupled to the first connection pad; and/or the second driving circuit is coupled to the second connection pad.
 3. The electronic device according to claim 1, wherein the first substrate further comprises a third connection pad, the second substrate further comprises a fourth connection pad, and the third connection pad is coupled to the fourth connection pad.
 4. The electronic device according to claim 3, wherein the first driving circuit is coupled to the third connection pad; and/or the second driving circuit is coupled to the fourth connection pad.
 5. The electronic device according to claim 1, wherein the first substrate further comprises a third driving circuit.
 6. The electronic device according to claim 5, wherein the first substrate also comprises a first input connection pad, a second input connection pad, a first output connection pad, and a second output connection pad, wherein a terminal of the first driving circuit is coupled to the first input connection pad, another terminal of the first driving circuit is coupled to the first output connection pad, a terminal of the third driving circuit is connected to the second input connection pad, and another terminal of the third driving circuit is coupled to the second output connection pad.
 7. The electronic device according to claim 5, wherein the first substrate further comprises a fifth connection pad, and the first driving circuit and the third driving circuit are coupled to the fifth connection pad.
 8. The electronic device according to claim 1, wherein the first substrate also comprises a fifth driving circuit.
 9. The electronic device according to claim 8, wherein the first substrate also comprises a third input connection pad and a third output connection pad, wherein a terminal of the fifth driving circuit is coupled to the third input connection pad, another terminal of the fifth driving circuit is coupled to the third output connection pad.
 10. The electronic device according to claim 1, wherein the second substrate also comprises a fourth driving circuit.
 11. The electronic device according to claim 10, wherein the second substrate also comprises a first input connection pad, a second input connection pad, a first output connection pad, and a second output connection pad, wherein a terminal of the second driving circuit is coupled to the first input connection pad, another terminal of the second driving circuit is coupled to the first output connection pad, a terminal of the fourth driving circuit is connected to the second input connection pad, and another terminal of the fourth driving circuit is coupled to the second output connection pad.
 12. The electronic device according to claim 1, wherein the plurality of electronic components comprise photoelectric components, pyroelectric components, piezoelectric components, sensing components, or antenna components.
 13. The electronic device according to claim 1, wherein the first connection pad and the second connection pad are coupled through a first connection line disposed on the third substrate, and the first driving circuit and the second driving circuit are coupled in series through the first connection pad, the second connection pad, and the first connection line.
 14. The electronic device according to claim 3, wherein the third connection pad and the fourth connection pad are coupled through a second connection line disposed on the third substrate.
 15. The electronic device according to claim 1, wherein a terminal of the first driving circuit is coupled to an external circuit through a third connection line disposed on the third substrate, and another terminal of the first driving circuit is coupled to a corresponding electronic component through a signal line disposed on the third substrate.
 16. The electronic device according to claim 1, wherein a third connection line belongs to same layer as a signal line.
 17. The electronic device according to claim 7, wherein the fifth connection pad is coupled to the first driving circuit and the third driving circuit through a fourth connection line disposed on the third substrate.
 18. An electronic device, comprising: a plurality of electronic components; a first substrate, comprising: a first driving circuit; a second driving circuit; a plurality of connection pads, wherein at least one of the plurality of connection pads is coupled to the first driving circuit and the second driving circuit; and a second substrate, wherein the first substrate and the plurality of electronic components are disposed on the second substrate.
 19. The electronic device according to claim 9, wherein the first substrate further comprises a first input connection pad, a second input connection pad, a first output connection pad, and a second output connection pad, wherein a terminal of the first driving circuit is coupled to the first input connection pad, another terminal of the first driving circuit is coupled to the first output connection pad, a terminal of the second driving circuit is coupled to the second input connection pad, and another terminal of the second driving circuit is coupled to the second output connection pad.
 20. The electronic device according to claim 9, wherein the plurality of electronic components comprise photoelectric components, pyroelectric components, piezoelectric components, sensing components, or antenna components. 